One machineDie pick from: wafer, waffle pack, Gel-Pak, feederDie place to: substrate, boat, carrier, PCB, leadframe, waferHot and cold processes supported:Įpoxy, soldering, thermo-compression, eutecticįootprintL x D x H: 1160 mm x 1225 mm x 1800 mm
Pick & Place HeadDie Attach, Flip Chip and Multi-Chip in
Vision AlignmentNew high-speed image processing unit Full alignment & Bad mark searchPre-defined fiducial geometry & customized teachingĪutomatic Wafer and Tool ChangerFully Automatic cycle for Multi-Chip productionUp to 7 Pick & Place tools (optionally 14), 5 eject toolsStamping tools and calibration tools possible PerformanceX/Y placement accuracy: 7 m 3sįlip Chip:with dipping up to 2,500 UPH/moduleīond HeadsStandard bond head 0 - 360 rotation Integrated DispenserPressure/time (Musashi), Auger, Jetter typesĪvailableEpoxy stamping optionFilled and unfilled epoxy, wide viscosity rangeSmall footprint, low cost-of-ownership The Datacon 2200 evoplus die bonder for Multi Module Attach sĪssembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lowercost-of-ownership.īesides unbeaten flexibility and full customization possibilities,this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, andimproved cleanroom capabilities.
The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.ĮnhancementsPLUS AccuracyPLUS ProductivityPLUS FlexibilityįeaturesMulti-Chip CapabilityFlexibility for CustomizingOpen Platform Architecture Innovative Solution for Innovative Products
0 kommentar(er)
